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DeepCool EX750 heat sink compound Thermal paste 6.2 W/m·K 3 g
R-EX750-GY030C-G-1
2x 1.5 g, 6.2 W/m*K Thermal Conductivity, 2.6 g/cm3 Specific Gravity
Description
DeepCool EX750 high performance thermal paste is crafted for extremely low thermal resistance for efficient heat dissipation in any scenario.
INDUSTRIAL GRADE THERMAL INTERFACE
DeepCool EX750 offers extremely low thermal resistance that maximizes heat transfer and dissipation for high performance CPU & GPU (desktop/laptop) components.
THE BEST MATCH, EVERY TIME
A smooth consistency allows for easier application and helps fill in every microchannel between surfaces for excellent thermal conductivity.
SAFE AND STABLE
DeepCool EX750 is a highly stable thermal compound and not electrically conductive or hazard to your PC components.
Product Details
R-EX750-GY030C-G-1
50 Items
Data sheet
- Thermal conductivity
- 6.2 W/m·K
- Specific gravity
- 2.6 g/cm³
- Thermal resistance
- 0.03 °C/W
- Product colour
- Grey
- Weight
- 3 g
- Operating temperature (T-T)
- -50 - 250 °C
- Package type
- Blister
- Type
- Thermal paste
- Quantity per pack
- 2 pc(s)